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"20 sets UV/YAG and over 160 CO2
laser heads
ELIC (Every Layer Interconnection)
Skipped, telescopic, stacked µvias
30 layers
Min. microvia - 80µm
Soldermask Registration: 25µm using
direct imaging
50 um dielectric using 106 prepreg and
40 um core handling available
RoHS compliance
Lead free & Halogen free
http://www.hemeixinpcb.com"
PCB Solutions Microvia PCB
Hemeixin Electronics Co.,Ltd
