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"Flex, rigid flex, and rigid PCB form factors
SMT, through-hole, and mixed technology
Board sizes up to 18” x 14”
Complex, high density assemblies
PBGA, CBGA, TBGA, FPGA, CGA, LGA
Package on Package (PoP) assembly
Micro BGA (0.4mm)
0402s, 0201s, 01005s
Wave and selective solde
http://www.hemeixinpcb.com
"
PCB Assembly
Hemeixin Electronics Co.,Ltd
